Electronic Design

TI “Transforms” Isolated Power Modules with Multichip Packaging Tech

The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.
EDN

Chiplets: 8 best practices for engineering multi-die designs

Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...
Nuclear Engineering International

Key module installed at Bailong 1

China's State Power Investment Corp. has installed the CA20 module at Bailong Unit 1, following placement of first concrete ...
IEEE

A Novel Double-sided Cooling 3L-ANPC SiC MOSFET Power Module with Interleaved Layout

Abstract: For 1500V voltage applications up to hundreds of kilowatts of power, integrated power modules adopting various 3-level circuits are widely used. This paper proposes a novel double-sided ...
Electronic Design

Multiphase Power Module Supplies AI from Beneath the Board

How Infineon's multiphase power modules bring vertical power to power-hungry systems. Benefits and key components of the vertical power modules. Current sensing and heat monitoring features. In data ...
IEEE

Multichip Parallel Double-Sided Cooling Silicon Carbide Power Module With Low Parasitic Inductance and Balanced Dynamic Current

Abstract: The application of multichip parallel silicon carbide (SiC) power modules requires packages that have low parasitic inductance and balanced dynamic current among different devices. The ...
EDN

EV system design from components to modules to software

Electric vehicle (EV) design at the system level is a rapidly evolving landscape encompassing components, hardware modules, and software platforms. So, on the first day of Automotive Tech Forum 2026, ...