Telit Cinterion to Showcase Smart Module Cluster and Advanced Connectivity Solutions at DTECH 2026

Telit Cinterion demonstrates how utilities can accelerate grid modernization with secure, scalable IoT and edge intelligence.
IEEE

FreshSpec: Sashimi Freshness Monitoring With Low-Cost Multispectral Devices

Abstract: Monitoring sashimi freshness, i.e., histamine levels, in showcases poses a critical challenge for sushi restaurants and fresh food stores. Current histamine monitoring methods involve ...
IEEE

A Fast and Intelligent Monitoring of Solder Layer Degradation in Multichip IGBT Modules Based on Copper Substrate Temperature Field Reconstruction

Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...