(a) Schematic of vapor deposition process with two heat zones. (b) SEM image of fibers formed on SiO2/Si substrate. (c) Comparison of XRD data for fibers and the source. (d) TEM image of a fiber. (e) ...
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...
Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...
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