Leveraging IsoShield multichip packaging, TI’s isolated power modules deliver up to 3× the power density of discrete devices.
Onsemi's hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430 kW liquid-cooled ...
SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...
SK Signet (KONEX: 260870), a global manufacturer of high-power EV charging solutions based in South Korea, announced that it ...
JinkoSolar, the global leading PV and ESS supplier, has globally launched its new AIDC modules for data centers. Built on the proven Tiger Neo 3.0 TOPCon platform technology, this product is ...
Santa Clara, CA and Kyoto, Japan, March 12, 2026 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid ...
The "Automotive-Grade Power Semiconductor and Module (SiC, GaN) Industry Research Report, 2025" has been added to ResearchAndMarkets.com's offering. SiC/GaN research indicates a significant uptick in ...
Abstract: As materials and fabrication processes advance, the medium voltage (MV) silicon carbide (SiC) power semiconductors featuring exceptional electrothermal properties are emerging in high-power ...
The third-generation series of QSiC MOSFET modules from SemiQ Inc. offer current capabilities of up to 608 A and a junction-to-case thermal resistance of just 0.07ºC/W to address the growing demand ...
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