Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material ...

Abstract: We propose a method that enables real-time endpoint detection during plasma etching of small openings (the absolute area of the opening is at or below 5%) on a wafer. Traditional endpoint ...

Abstract: We have developed a novel plasma etch singulation technique that eliminates the need for any temporary bonding materials in-between the device wafer and the carrier wafer during the etch ...