KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Hideo Tanimoto, hereinafter "Kyocera")(TOKYO:6971) is pleased to announce the development of a pluggable optoelectronic module (OSFP-XD ...

We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, ...

The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 ...

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, will participate in OFC 2026, taking place March 17–19, 2026 at the Los Angeles Convention Center. MACOM will ...

Scalable Edge Performance for Demanding Applications SAN DIEGO, CA, UNITED STATES, March 13, 2026 /EINPresswire.com/ -- ...

Kyocera Corporation has announced the development of a pluggable optoelectronic module (OSFP-XD2) supporting the PCIe3 6.0 standard as a new product in its OPTINITY4 optoelectronic module series, ...

At NVIDIA GTC 2026 we got to see some of the most cutting-edge tech that will power the future of AI, covering memory, ...

A key innovation of the P100 COMx6 series is SolidRun's LP-CAMM2 memory integration in an industrial COM Express Type 6 module, delivering the best of all worlds: the serviceability of modular memory ...

Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure ...

The result of the mod is less a novelty case mod and more a proof-of-concept for what a hybrid Xbox/PC box could look like in ...

Compliant to all IEEE and OIF standards, capable of supporting LR links on the chip to module electrical interface 400G/lane technology is the next evolution of 200G/lane architectures, enabling a ...

Will showcase cutting-edge technologies shaping the future of optoelectronics and accelerated computing Ongoing demonstrations March 17-19 at Los Angeles Convention Center BOSTON, March 05, 2026 ...