IEEE

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

Abstract: Based on High Bandwidth Memory (HBM) structure and taking into consideration the direct interconnection between the micro-bump and the end of the Cu-filled TSV, there is an interaction ...
IEEE

Deep Q learning for traffic simulation in autonomous driving at a highway junction

Abstract: Trafïîc congestion is a serious global problem. Enhanced or deep Q learning algorithms were applied to a traffic simulation study. The enhanced Q learning was based on a repeated local ...