A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D ...

In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...

Engineers suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials. Moore's Law, a fundamental scaling principle for electronic devices, forecasts ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...