In the past decade, chemical-mechanical polishing (CMP) has emerged as the predominant planarization technique for shallow trench isolation (STI) and back end of the line (BEOL) metallization. To ...

It's critical that the surface of silicon wafers be as flat as possible so that as each metal layer is patterned, you minimize the risk of moving in and out of the focal plane of the imaging system.

Context-aware physical verification (PV) is a relatively new addition to traditional PV flows, but it has quickly become a critical and essential technology that addresses the increasing complexity of ...