The field of abrasive flow processing harnesses the power of fluid dynamics to deliver high-precision surface finishing and material removal in complex engineering components. This technique utilises ...

Considering the characteristics of large slenderness ratio structure, it is reasonable to simplify the dynamics of a HALE aircraft as the plunge, pitch, and flap motions of a planar airfoil. The ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Deposition of many important materials such as semi-conductors is performed using energetic jets under low pressure conditions. In addition, materials that have been deposited, such as silicon, are ...