Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

Want smarter insights in your inbox? Sign up for our weekly newsletters to get only what matters to enterprise AI, data, and security leaders. Subscribe Now After several decades of hope, hype and ...

Physicists show that the shape of components is a major determinant of how quickly and efficiently complex structures self-assemble. Physicists at LMU Munich show that the shape of components is a ...

Researchers have developed a new two-photon polymerization technique that uses two lasers to 3D print complex high-resolution structures. The advance could make this 3D printing process less expensive ...