IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...

Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address ...