Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into volume production ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips. Save my User ID and Password ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

"Advanced IC Substrates Market"Mordor Intelligence has published a new report on the Advanced IC Substrates Market, offering a comprehensive analysis of trends, growth drivers, and future projections.

New research suggests that materials commonly overlooked in computer chip design actually play an important role in information processing, a discovery which could lead to faster and more efficient ...