Building a chip fabrication facility requires billions of dollars in investment for land, buildings, processing equipment, chemical and hazardous material safety, not to mention the deployment of ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

FuGasity Corp. today said it has received a notice of allowance for a patent from the U.S. Patent and Trademark Office. The patent would cover the Allen, Texas-based company’s technology for ...

Directed Self-Assembly (DSA) is an emerging technology that has the ability to substantially improve lithographic manufacturing of semiconductor devices. In DSA, copolymer materials self-assemble to ...