The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

In context: Manufacturers are trying to develop novel chip substrate technologies to save Moore's law and keep crunching the Megahertz rates up. Glass is the most promising material for next-gen ...