From AI to high-performance computing -- we take a look at emerging use cases and predictions in the industry AUSTIN, ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...

ONYX 3200 metrology equipment enables the complete metal inspection for all processes -- from chip wiring to advanced ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

TSMC leads AI chip manufacturing with record 2024 results and 2nm/CoWoS growth. See why I rate the TSM stock a Buy.

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various ...