SPICE Simulator Noted for Post-Layout Simulation Capabilities for Analog/Mixed-Signal Designs with Complex Interconnect Delays at 40nm and Below SANTA CLARA, Calif., Nov. 29, 2016 – ICScape today ...
As noted in a recent blog post, demand for more memory is a common theme for many semiconductor-driven products. Artificial intelligence (AI) and machine learning (ML) algorithms rely on fast, ...
SANTA CLARA, Calif., May 13, 2025 (GLOBE NEWSWIRE) -- Silvaco Group, Inc. (SVCO) (“Silvaco”) (NASDAQ: SVCO), a leading provider of TCAD, EDA software, and SIP solutions that enable semiconductor ...
FineSim SPICE 2018.09 delivers 3X faster runtime for analog circuits, adds RF analysis features Custom Compiler's Extraction Fusion with StarRC provides early parasitics for accurate pre-layout ...
MOUNTAIN VIEW, Calif. -- March 12, 2018 -- Synopsys, Inc. (Nasdaq: SNPS) today announced release of the latest versions of its circuit simulation and custom design products—HSPICE®, FineSim® SPICE, ...
DDR memory is quickly becoming not only the leading technology but the only technology used in memory design. As such, DDR systems are in high demand in the tech industry. High-speed simulation tools ...
Alps Alpine selects Jivaro Pro to improve designer productivity and safeguard time-to-market goals Jivaro Pro is a unique stand-alone tool offering advanced parasitic reduction to dramatically ...
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