A few guidelines show how to correctly use FEA stresses to find reasonable margins of safety. Although finite-element analysis has become an indispensable part of engineering, a few users knock it ...

Designers of electronic systems are finding that mechanical issues are frequently becoming a major issue in product development, especially in RF design. To address these issues, Ansoft has introduced ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

Here's when to use linear-static FEA and when to use a nonlinear program. Most engineering problems contain nonlinear effects. Take a paper clip, for example. Push on one end hard enough and the clip ...

The ePhysics thermal and stress analysis tool expands the capabilities of the company's HFSS and Maxwell 3D by incorporating 3-D steady-state thermal, transient thermal and linear stress analysis into ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...