The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association and IPC — Association Connecting Electronics Industries® today announced the publication of an update to J-STD-020, ...
Although PCBs are the basic foundational block for all electronic circuits in today’s generation, it is essential to follow several rules and guidelines while designing the circuits. These rules are ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback