As many of you may have seen, we’ve passed a major milestone since Siemens announced its intent to acquire Mentor Graphics four years ago. As of January 1, 2021, “Mentor, a Siemens business” has ...
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
The latest platform to join athenahealth’s More Disruption Please program is IC System, a provider of debt collection and healthcare revenue cycle services. Through this partnership, athenahealth ...
Integrity 3D-IC is Cadence’s next-generation multi-chip design solution, integrating silicon and package planning and implementation with system analysis and signoff to enable system-driven PPA ...
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Melexis' MLX90821 relative pressure sensor IC is designed for measuring low pressures in automotive applications. Using the latest MEMS technology, closely integrated with an analog signal chain and ...
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