Ottawa, Oct. 22, 2024 (GLOBE NEWSWIRE) -- The global semiconductor & IC packaging materials market size is predicted to increase from USD 48.54 billion in 2025 to approximately USD 113.29 billion by ...

Dublin, April 15, 2024 (GLOBE NEWSWIRE) -- The "Global Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Semiconductor data sheets have changed a lot in the last few years, including growing from 10 pages to a hundred. The problem is that data sheets contain almost too much data, and there's not enough ...