As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore’s Law produce the results achieved in earlier generations. Increasing the die size in a monolithic ...
Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever ...
The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...
Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...
Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...
Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced a total order backlog of $500 million comprised of more than $100 million for its lithography and ...
The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...
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