Scientists have identified a method for improving the thermal conductivity of thin metal films in semiconductors using surface waves for the first time in the world. The demand to shrink the size of ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

Ultraviolet-B (UV-B) semiconductor lasers are highly sought for medical, biotechnology, and precision manufacturing applications; however, previous UV-B laser diodes were limited to pulsed operation ...

Hiden Analytical is revolutionizing the field of semiconductor process development and monitoring with their state-of-the-art ion implantation and diffusion techniques, combined with the highly ...

SEOUL, Sept. 3 (Yonhap) -- Samsung Electro-Mechanics Co. and LG Innotek Co. on Wednesday showcased their latest package substrates for artificial intelligence, server and automotive sectors at a ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

A p-n junction is an interface or boundary between p-type and n-type semiconductor materials within a single semiconductor crystal. The positive (p) side contains excess holes, while the negative (n) ...