At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

With every process node advance, new types of manufacturing defects manifest. These defects are especially prevalent during the early phase. For early adopters, silicon manufacturing tests must evolve ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

The decision to change from a functional to a structural test methodology is a far-reaching one. Functional test vectors are meant to check for correct device functionality. Structural test vectors ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...

Don Cowan and Mahyar Mohammadnezhad of Kiwa PI Berlin explain the importance of upstream diligence in ensuring long-term PV ...

Whether you call it test automation, automated testing, or something else, using software tools to help speed up the execution of software testing is an essential element of successful software ...