Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. This process, which involves electrically connecting semiconductor devices to their packages, ...

“Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire ...

At the National Institute for Fusion Science researchers have introduced a new metallurgical method (brazing technique) for bonding tungsten and copper alloys. They achieved a superior bonding layer ...